Laser Marking and laser cutting applied on IC component
Electronic component, IC component are very smaller comparing with consumer electronic. Marking on It or cutting it needs higher precision. Traditional marking or cutting way is difficult to reach a high quality; laser marking and laser cutting technology are the best way. Laser marking and laser cutting technology are very suitable for the production of electronic components. The technology is significantly superior to traditional manufacture mode. Laser marking machine can mark SD cards, touch screens and phone keypads etc. while laser cutting machine cuts them. And also laser technology can peel cables to make fine line row for digital productions.
There is a very good point for laser marking or laser cutting applied on Electronic component, IC component. Laser processing including laser marking, laser cutting and laser welding will not contact the workpiece directly, thus it does not cause any mechanical extrusion or stress and will not alter the physical properties of the materials processed. What is more, laser focusing size is very small and the heat-affected region is quite small too, thus laser processing can achieve fine processing which other conventional methods cannot get.
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